Heat dissipation board materials - メーカー・企業と製品の一覧 | イプロス

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Ultra-thin, lightweight heat dissipation substrate without adhesive type! It can be processed in three dimensions, allowing for the production of substrates in various shapes!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be processed in three dimensions, making it suitable for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ Three-dimensional processing is possible, allowing for the creation of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, resulting in good machinability. ■ It is suitable for chip-on-board (COB) mounting of bare chips. *For more details, please request materials or view the PDF data available for download.